Ceramic Wafer Chuck

The wafer chuck ensures accurate positioning of the wafer in various process steps.

Ceramic wafer chuck.

Our wafer chuck tables electrostatic chucks and heaters are virtually found in many semiconductor equipment in most of. With applications for the semiconductor industry ever diversifying so are the substrate and materials used to provide new products. Semixicon is based in the silicon valley serving world wide semiconductor photonics and medical etc industries with precision ceramic machining and assembly solutions with our core technology of wafer handling chuck tables. Porous ceramic vacuum chuck.

The chuck has a pore size of less than 25 microns 60 microns optional assuring uniform suction and strong holding power for even the smallest parts. By using ceramic materials flatnesses of less than 1 micron can be achieved. The shape of the ceramic chuck can be dressed to a conic shape with a very small angle see fig. Vacuum wafer chucks are used in the semiconductor industry to accurately position the wafer in the machine.

Arc also manufactures custom chucks from a customer s drawing or solid model. Pared with ceramic the electrostatic force is 1 10 smaller and. The chuck plate plays an integral part in supporting the wafer throughout processing not just to accurately position the wafer during testing. Photomachining offers a variety of porous vacuum chuck designs for use with thin films semiconductor wafers and other flat samples.

We are providing below ceramic chuck table products services new and refurbished porous ceramic chucks for disco adt k s applied materials tsk okamoto micro automation load point etc dicing saws and grinders 4 5 6 8 12 regular size available in round square oval shape or irregular shapes and sizes high precision of surface flatness of 2 micron custom chucks for dicing. Shown on the right is a 6 inch diameter free standing porous ceramic chuck plate with pores size 20um 10. Advanced ceramic vacuum wafer chucks materials developed specifically for wafer handling as a leader in technical ceramics for wafer processing equipment coorstek understands advanced semiconductor manufacturing and constantly develops new materials designs and processes to optimize yields and extend product life. When the wafer is held on the chuck it elastically deforms to the chuck s conic shape thus ensuring that the grinding wheel only contacts half of the wafer at any given instant.