Ceramic Substrate Thermal Conductivity

Silicon carbide sc1000 200.

Ceramic substrate thermal conductivity.

Science and technology 2001. Information of silicon carbide. Direct bonded copper dbc substrates are commonly used in power modules because of their very good thermal conductivity they are composed of a ceramic tile commonly alumina with a sheet of copper bonded to one or both sides by a high temperature oxidation process the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm. Aln is a widely used ceramic in thermal management components with a thermal conductivity of approximately 180 w mk.

Ceramic substrates have a much higher thermal conductivity than pcb materials promoting transfer of the heat generated in the circuit to the outside where it may be safely dissipated. Low temperature co fired ceramics. Aluminum nitride an216a 150. The thermal conductivity of ceramic materials plays an important role in its application.

It can be produced through a variety of manufacturing methods but it is most commonly available in tape cast substrate form approximately 1mm thick. In a certain range increasing the thermal conductivity of ceramic materials by specific methods will improve its ability of heat conduction heat convection and heat radiation so as to further expand its application field. September 1 1999 clemens j.